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Home > products > Hot Melt Adhesive Tape > Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape

Product Details

Place of Origin: China

Brand Name: Tunsing

Certification: SGS , ISO9001

Model Number: DS-6CA

Payment & Shipping Terms

Minimum Order Quantity: 20 rolls

Price: negotiable

Packaging Details: 100 yard in a roll, 1 rolls in a carton, or it's up on the customer's request

Delivery Time: 5-7days

Payment Terms: Western Union, L/C, T/T, PayPal

Supply Ability: 40000 Square meters per day

Get Best Price
Highlight:

hot melt adhesive film

,

thermal adhesive tape

Color:
Black
Melting Point(°C):
80-100℃
Melt Index(g/10min):
20±10g/10min
Hot Pressing Temperature(°C):
140 ℃ To 200 ℃
Physical Form:
Glassine Release Paper
Conventional Thickness:
55±5μm
Conventional Width:
29mm
Length:
200m
Density:
1.2±0.02g/cm³
Packing:
Vacuum Package
Color:
Black
Melting Point(°C):
80-100℃
Melt Index(g/10min):
20±10g/10min
Hot Pressing Temperature(°C):
140 ℃ To 200 ℃
Physical Form:
Glassine Release Paper
Conventional Thickness:
55±5μm
Conventional Width:
29mm
Length:
200m
Density:
1.2±0.02g/cm³
Packing:
Vacuum Package
Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape

 

 Physical Characteristics:

 

Color Black Release Line Glassine release paper
Density ASTM D-792 1.±0.02 g/cm³ Conventional Thickness 55um
Melting Range DSC 80-100℃ Conventional Width 29MM
Melt Index ASTM D-1238 20±10g/10min Conventional Length 200M
Finished Products 55um*29MM*200M

Recommended bonding conditions:

Flat initial chip backing Flat secondary packaging:
Mechanical mold temperature: 140 ℃ to 160 ℃ Mechanical mold temperature: 170 ℃ to 200 ℃
Adhesive time: 0.6s-1.2s Sealing time: 1.4 s-2.4 S
Pressure: 0.25-0.4 mpa Pressure: 0.25-0.4mpa

 

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

 

 

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 0

 

Quick detail:

The hot melt adhesive has good electrical conductivity and is packaged by a dual interface smart card. Excellent adhesion to PVC, ABS, PC, FR-4 and other materials.

This product is a large molecular weight structural hot melt tape. The superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base. Meets the requirements of IC7816 for chip package fastness.

 

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 1


The conventional width of a roll fim is 200m, but the width can make on the customer's request.

 

Applications:
Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 2


 

 

Customer Feedback:
 

 

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 3


Packing and Shipping:
Packing: 200m in roll, 20 rolls in case
Shipping: 5-7days by Express (DHL, FedEx, USP and so on) and by air, and 30-40 days by sea.


Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 4

 

Smart Cards India Expo 2018

Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 5


Why Choose Us
1, more than 10 years experience in production.
2, well-known products: Sichuan Famous Brand.
3, Good quality control in production process: Quality Service AAA Grade Credit Enterprise
4, Excellent quality and Competitive price, OEM is available.
5, Stable supply: an extensive range of stock.
6, The whole process from material to end products is under supervision.


FAQ:
Q1) . What is hot melt adhesive tape?
A: It is just a tape, and the basic material is release paper. But the tape is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive tape have different performances and different usages, we need understand your products needs, then recommend you right products,
Q2).Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years domestic sale experience, we are able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know,
Q3).How do you ship the products?
If you are not urgent, we usually transport by sea in large quantity, which is the cheapest shipping way. And for samples and urgent cargo, we transport it by air or by express, as it is the fastest way etc,
Q4). Do you provide free sample? And how many days it will take?
Yes, of course.we provide free 3-5Y sample for your testing only need you to pay the shipping cost. We will make the sample within 3 working days and it will take 3-7days on the transportation., then you will have more confidence in our product quality and service,
Q5). How long is the lead time?
Sample lead time: 1-3 days
Bulk lead time: 7-20days(depends on order quantity),
Q6). How do I pay for my order?
We usually accept L/C ,T/T ,Western Union , Paypal.


 

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Application for Dual Interface Cards Double Sided Thermal Adhesive Conductive Hot Melt Adhesvei Tape 6