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Home > Products > Hot Melt Adhesive Powder > PES Hot Melt Adhesive Powder with Strong Dry Cleaning Resistance and 102-115 ℃ Melt Point for DTF Printing in 80-200μm Powder Size

PES Hot Melt Adhesive Powder with Strong Dry Cleaning Resistance and 102-115 ℃ Melt Point for DTF Printing in 80-200μm Powder Size

Product Details

Place of Origin: China

Brand Name: TUNSING

Certification: ISO 9001 SGS Oeke-TEX

Model Number: DS207

Payment & Shipping Terms

Minimum Order Quantity: 20kg

Price: negotiable

Packaging Details: 20kilogram/bag

Delivery Time: 3-5 work days after received the payment

Payment Terms: L/C,T/T,Western Union,Western Union

Supply Ability: 6000000 kg/Month

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Name:
PES Hot Melt Adhesive Powder
Melt Point DSC:
102-115 ℃
Melt Index ASTM D-1238:
32±3 G/10min
Density ASTM D-792:
1.20±0.02 G/cm³
Powder Size Range:
80-170μm, 80-200μm
Temperature:
130℃
Name:
PES Hot Melt Adhesive Powder
Melt Point DSC:
102-115 ℃
Melt Index ASTM D-1238:
32±3 G/10min
Density ASTM D-792:
1.20±0.02 G/cm³
Powder Size Range:
80-170μm, 80-200μm
Temperature:
130℃
PES Hot Melt Adhesive Powder with Strong Dry Cleaning Resistance and 102-115 ℃ Melt Point for DTF Printing in 80-200μm Powder Size
PES Hot Melt Adhesive Powder Strong Dry Cleaning Resistance For DTF Printing
Strong Dry-cleaning Resistance Adhesive Powder Copolyester PES Hot Melt Adhesive Powder for DTF Printing

PES Hot Melt Adhesive Powder
PES hot melt adhesive powder is a type of thermoplastic adhesive commonly used in industrial applications. PES stands for Polyethersulfone, a high-performance engineering plastic. The adhesive powder consists of small particles formulated with a low melting point, allowing them to melt and flow when heated.

Application Areas
  • Electronics: Used in assembly and bonding of electronic components like circuit boards, connectors, and cables. Offers high heat resistance and excellent electrical insulation properties.
  • Automotive: Applied for bonding interior trim, wiring harnesses, and sensors. Provides strong adhesion and withstands demanding automotive conditions including high temperatures and vibrations.
  • Medical: Utilized in medical device manufacturing where secure, biocompatible bonds are required for instruments, catheters, and disposable medical devices.
PES Hot Melt Adhesive Powder with Strong Dry Cleaning Resistance and 102-115 ℃ Melt Point for DTF Printing in 80-200μm Powder Size 0
Bonding Range
  • Plastics: ABS, PVC, polycarbonate, polypropylene, and polyethylene
  • Metals: Aluminum, stainless steel, copper, and brass for metal-to-metal or metal-to-plastic applications
  • Wood: Plywood, particleboard, MDF, and solid wood
  • Textiles: Cotton, polyester, nylon, and synthetic blends for textile laminations and fabric-to-fabric applications
Physical Characteristics
Property Criterion
Appearance White powder
Composition CO-PES
Density ASTM D-792 1.20±0.02 g/cm³
Melt Point DSC 102-115 ℃
Melt Index ASTM D-1238 32±3 g/10min
Powder size range 0-80μm, 0-120μm, 0-160μm, 0-170μm
80-170μm, 80-200μm
125-200μm, 150-250μm, 180-420 μm
Technical Parameters
Bonding Parameters (for reference only)
Temperature 130℃
Press 3.0 kg/cm²
Time 14 S
Washing Resistance 40℃ Excellent
Washing Resistance 60℃ /
Washing Resistance 90℃ /
Packaging and Storage
Packaging 20KG per bag, packed in PE inner bag + kraft bag
Storage Conditions Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.
Customer Feedback
  • Strong Bonding: Customers highlight the strong bonding capabilities, creating durable and reliable bonds between various materials
  • Versatility: Suitable for bonding wide range of substrates including plastics, metals, wood, textiles, and foam
  • Fast Setting: Quick setting time allows for faster production processes and increased efficiency
Packing & Shipping

Packing: 20KG per bag
Shipping: 5-7 days

PES Hot Melt Adhesive Powder with Strong Dry Cleaning Resistance and 102-115 ℃ Melt Point for DTF Printing in 80-200μm Powder Size 1