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Home > products > Hot Melt Adhesive Tape > Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards

Product Details

Place of Origin: China

Brand Name: None

Certification: ISO, ROHS, REACH, Oeko-Tex

Model Number: DS-4

Payment & Shipping Terms

Minimum Order Quantity: 20 rolls

Price: USD20-25/roll

Packaging Details: Carton size: 40cm*40cm*16.5cm. A carton of twenty rolls. All of them are vacuum packed.

Delivery Time: 3-15 work days

Payment Terms: L/C, T/T, PayPal, Alibaba Trade Assurance

Supply Ability: 10000 rolls per month

Get Best Price
Highlight:

hot melt adhesive film

,

pressure sensitive adhesive tape

Color:
Transparent
Density:
1.12±0.02g/cm³
Melting Point:
100-110℃
Melt Flow Index:
110±15g/10min ; Condition: ASTM D1238-04
Conventional Thickness:
55±5μm
Conventional Width:
29mm
Conventional Length:
200m
Finished Products Specification:
55UM*29MM*200M
Release Liner:
Glassine Release Paper
Color:
Transparent
Density:
1.12±0.02g/cm³
Melting Point:
100-110℃
Melt Flow Index:
110±15g/10min ; Condition: ASTM D1238-04
Conventional Thickness:
55±5μm
Conventional Width:
29mm
Conventional Length:
200m
Finished Products Specification:
55UM*29MM*200M
Release Liner:
Glassine Release Paper
Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards

Strong Adhesion Smart Card Hot Melt Adhesive Tape , 0.055mm * 29mm * 200M For Embedding of Chip-modules Into Smart Cards

 

Product: DS-4

 

Smart Card Tape Description:

The hot melt adhesive is used in the encapsulation of contact smart card. Excellent adhesion to PVC, FR-4 and other materials.

This product belongs to medium and low temperature hot melt adhesive tape. The strong cohesive force and good flexibility ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.

 

Smart Card Tape Applications:

DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and contact bank card.

 

Smart Card Tape Composition:

Polyamide synthesis modification

 

Smart Card Tape Physical Characteristics:

 

Color Transparent Release liner Glassine release paper
Density 1.12±0.02g/cm³ Conventional Thickness 55±5μm
Melting point 100-110℃ Conventional Width 29mm
Melt Flow Index

110±15g/10min ;

Condition: ASTM D1238-04

Conventional Length 200m
    Finished Products Specification 55UM*29MM*200M

 

Recommended Bonding Conditions:

 

First Lamination: Second Implanting:
Machine Setting: 130-150 Machines Setting: 160-180
Time: 0.6S-1.2S Time: 0.6S-1.2S
Pressure: 0.25-0.4mpa Pressure: 0.25-0.4mpa

 

 

 

 

 

 

 

Detail Images:

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 0

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 1

 

 

Application Images:

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 2

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 3

 

Packaging & Delivery:

Carton size: 40cm*40cm*16.5cm
A carton of twenty rolls.
All of them are vacuum packed.
Shipped in 3-7 days after payment.

 

Our Services:

1, Your inquiry will be replied within 24 hours and online service is available all the time.
2, Well-trained & professional sales persons are here ready to answer all your questions and handle the problems.
3, Prompt delivery time: within 15 days after agreement.
4, Flexible payment terms: T/T, L/C, O/A, Western Union, Paypal, Escrow, etc.
5, Your business relationship with us will be confidential to any third party.
6, Good after-sale service offered, please get back if you got question.

 

Certifications:

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 4

 

Exhibition Pictures:

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 5Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 6

 

Buyer Feedback:

Glassine Release Paper Hot Melt Adhesive Tape Embedding Chip Modules Into Smart Cards 7

 

 

FAQ:

 

1 .How about hot melt adhesive film?

It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point,it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands,then recommend you right products to you.

 

2.Do you accept OEM or ODM?

Yes ,we accept OEM and ODM,we are professional heat transfer material manufacturer ,having more than 10years experience.able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us konw.

 

3.How do you transport the products?

If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,

we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way.Of course if you have other better idea about transport, we will accept it.

 

4. May I have your samples?

If you need some sample for reference,please let us know your fully address/ship

mode with courier,and we will arrange sample for your reference.

 

5. How long is the lead time?

Sample lead time:3-7 days

Bulk lead time:7-10 days(depends on order quantity)

 

6. How do I pay for my order?

We accept L/C ,T/T ,Western Union , Paypal

 

Contact Me:

TEL:+86-18126266184   WeChat & WhatsApp:+86-18126266184

QQ:3584462016             Facebook:+86-18819481967