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Home > products > Hot Melt Adhesive Tape > IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent

IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent

Product Details

Place of Origin: China

Brand Name: Tunsing

Certification: SGS , ISO9001

Model Number: DS-4

Payment & Shipping Terms

Minimum Order Quantity: 100 Yards

Price: negotiable

Packaging Details: 100yard/roll, 1-2roll/CTN

Delivery Time: 5-8 work days

Payment Terms: T/T , Western Union, PayPal, L/C

Supply Ability: 10000000 Yards / Month

Get Best Price
Highlight:

thermal adhesive tape

,

pressure sensitive adhesive tape

Product Name:
Bonding Temperature 160-180 Degree Card Smart Adhesive Tape For IC Cards SIM Cards
Color:
Transparent
Width:
29mm
Thickness:
55±5μm
Length:
200m
Melting Point:
100-110℃
Melt Flow Index:
110±15g/10min ; Condition: ASTM D1238-04
Composition:
Polyamide
Packing:
100yard/roll, 1-2roll/CTN
Application:
Thermal Packaging Of IC Card, SIM Card, Etc
Product Name:
Bonding Temperature 160-180 Degree Card Smart Adhesive Tape For IC Cards SIM Cards
Color:
Transparent
Width:
29mm
Thickness:
55±5μm
Length:
200m
Melting Point:
100-110℃
Melt Flow Index:
110±15g/10min ; Condition: ASTM D1238-04
Composition:
Polyamide
Packing:
100yard/roll, 1-2roll/CTN
Application:
Thermal Packaging Of IC Card, SIM Card, Etc
IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent

Bonding Temperature 160-180 Degree Card Smart Adhesive Tape for IC cards SIM cards

 

Description:

 

The hot melt adhesive is used in the encapsulation of contact smart card. Excellent adhesion to PVC, FR-4 and other materials.

This product belongs to medium and low temperature hot melt adhesive tape. The strong cohesive force and good flexibility ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.

 

Product Image: 

 

IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 0

 

Composition:
 

Polyamide synthesis modification

 

Physical Characteristics:

 

Color
Transparent
Release liner
Glassine release paper
Density
1.2±0.02g/cm³
Conventional Thickness
55±5μm
Melting point
100-110℃
Conventional Width
29mm
Melt Flow Index
110±15g/10min ;
Condition: ASTM D1238-04
Conventional Length
200m, 300m, 400m
 
 
Finished Products Specification
55UM*29MM*200M
 

 

 

Recommended Bonding Conditions:

 

First Lamination:
Second Implanting:
Machine Setting: 130℃-150℃
Machine Setting: 160℃-180℃
Dwell Time: 0.6S-1.2S
Dwell Time: 0.6S-1.2S
Pressure: 0.25-0.4mpa
Pressure: 0.25-0.4mpa

 

IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 1
 

 

Applications:
 
DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and contact bank card

 IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 2

 

Test Equipment

In order to strengthen the management of quality , we purchase many kinds of test equipments.

for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester

IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 3


 

Tunsing culture

Tunsing spirit: innovation, efficiency, dedication Tunsing vision: Become a corporate model based on business principles and corporate ethics Tunsing mission: Improve manufacturing processes and promote social progress through continuous technological innovation Tunsing values: Respect, Integrity Business principles: Provide original solutions for sustainable customer development and build sustainable customer relationships. Environmental Protection: Provide practical and effective products and solutions for ourselves and our customers to meet the needs of the environment.


IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 4
 

 
FAQ :
 
1 .How about hot melt adhesive film?
A: It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands ,then recommend you right products to you.

 
2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years experience. able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know.

 
3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way .Of course if you have other better idea about transport, we will accept it.

 
4. May I have your samples?
If you need some sample for reference, please let us know your fully address/ship
mode with courier ,and we will arrange sample for your reference.

 
5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
 
6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , Paypal , Escrow
 
 
 
Contact Us:
 
IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent 5