Product Details
Place of Origin: China
Brand Name: Tunsing
Certification: SGS , ISO9001
Model Number: DS-5B
Payment & Shipping Terms
Minimum Order Quantity: 20 rolls
Price: negotiable
Packaging Details: 200M in a roll, 1 rolls in a carton, or it's up on the customer's request
Delivery Time: 5-7days
Payment Terms: Western Union, L/C, T/T, PayPal
Supply Ability: 40000 Square meters per day
Color: |
White Translucent |
Melting Point(°C): |
100°C -120°C |
Melt Index(g/10min): |
110±15g/10min; Condition:ASTMD1238-04 |
Hot Pressing Temperature(°C): |
150°C -180°C |
Physical Form: |
Glassine Release Paper |
Conventional Thickness: |
55±5μm |
Conventional Width: |
29mm |
Length: |
200m |
Density: |
1.2±0.02g/cm³ |
Packing: |
Vacuum Package |
Color: |
White Translucent |
Melting Point(°C): |
100°C -120°C |
Melt Index(g/10min): |
110±15g/10min; Condition:ASTMD1238-04 |
Hot Pressing Temperature(°C): |
150°C -180°C |
Physical Form: |
Glassine Release Paper |
Conventional Thickness: |
55±5μm |
Conventional Width: |
29mm |
Length: |
200m |
Density: |
1.2±0.02g/cm³ |
Packing: |
Vacuum Package |
Embedding Of Chip-modules Into Smart Cards Chip Module Hot Melt Adhesive Tape
Physical Characteristics:
Color | Black | Release liner | Glassine release paper |
Density | 1.2±0.02g/cm³ | Conventional thickness | 55um |
Melting Rang ( DSC ) | 100-120℃ | Conventional width | 29MM |
Melt Flow Index | 16±10g/10min Condition:ASTM D1238-04 | Conventional length | 200M |
Finished Products Specification | 55um*29MM*200M |
The hot melt adhesive is used in the encapsulation of contact smart card.Excellent adhesion performance to PVC, ABS, PC, FR-4 materials;In addition, the high heat in the manufacturing process of the carbon-based laser bar code causes damage to the chip module, which prevents the heat and avoids the module thermal necrosis.
Quick detail:
This product belongs to modified large molecular weight structure black hot - melt adhesive tape.Strong cohesive force ensures that the thrust and bending tests after bonding will not occur structural fracture;At the same time and chip and card to maintain a balanced bond strength.In line with ISO7816 standard for chip packaging fastness.
Applications:
DS-5B is suitable for thermal packaging of IC cards, SIM cards, financial social security cards, and dual interface bank cards.
First Lamination: | Second Implanting: | ||
Machine Setting: | 140℃-160℃ | Machines Setting: | 170℃-190℃ |
Time: | 0.6S-1.2S | Time: | 0.6S-1.2S |
Pressure: | 0.25-0.4mpa | Pressure: | 0.25-0.4mpa |
1, Bonding temperature and pressure as well as the time involved in the strength of the film to material. Bonding temperature must be close to the machine set the temperature, the pressure must be uniform, mold and pressure roller must be flat.
2, In different machinery and materials, the bonding conditions used will be different. The conditions marked here are only basic. The optimum bonding conditions should be made by creating suitable construction conditions for the particular application damage, direct or consequential, arising out of the use, misuse or inability to use the product.
In order to strengthen the management of quality , we purchase many kinds of test equipments.
for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester
Packing and Shipping:
Our company has passed ISO9001:2015 quality management system certification, and all products in our company are up to RoHS,REACH, Oeko-tex, California Proposition 65, Halogen Test Report, PFOA, PFOS, PAHS, HBCDD and other environmental standards.
Why Choose Us
1, more than 10 years experience in production.
2, well-known products: Sichuan Famous Brand.
3, Good quality control in production process: Quality Service AAA Grade Credit Enterprise
4, Excellent quality and Competitive price, OEM is available.
5, Stable supply: an extensive range of stock.
6, The whole process from material to end products is under supervision.
FAQ:
Q1) . What is hot melt adhesive tape?
A: It is just a tape, and the basic material is release paper. But the tape is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive tape have different performances and different usages, we need understand your products needs, then recommend you right products,
Q2).Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years domestic sale experience, we are able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know,
Q3).How do you ship the products?
If you are not urgent, we usually transport by sea in large quantity, which is the cheapest shipping way. And for samples and urgent cargo, we transport it by air or by express, as it is the fastest way etc,
Q4). Do you provide free sample? And how many days it will take?
Yes, of course.we provide free 3-5Y sample for your testing only need you to pay the shipping cost. We will make the sample within 3 working days and it will take 3-7days on the transportation., then you will have more confidence in our product quality and service,
Q5). How long is the lead time?
Sample lead time: 1-3 days
Bulk lead time: 7-20days(depends on order quantity),
Q6). How do I pay for my order?
We usually accept L/C ,T/T ,Western Union , Paypal.
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