Shenzhen Tunsing Plastic Products Co., Ltd.
ts02@tunsing.com.cn
86-755-8996-0062
Product Details
Place of Origin: Shenzhen,China
Brand Name: Tunsing
Certification: ROHS, REACH, Oeko-Tex
Model Number: DS-4
Payment & Shipping Terms
Minimum Order Quantity: 20 rolls
Price: USD20-28/roll
Packaging Details: 20roll/ctn,Carton size: 40cm*40cm*16.5cm.
Delivery Time: 1-3work days after received the payment
Payment Terms: L/C, T/T, PayPal, Alibaba Trade Assurance
Supply Ability: 50000 rolls per month
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Color:
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Light Yellow
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Proportion:
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1.08±0.02g/cm³
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Melting Point:
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70-95℃ (Tunsing DSC 214)
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Melt Flow Index:
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75±25g/10min（ASTM D1238-04）
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Conventional Thickness:
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0.055mm±0.008mm
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Conventional Width:
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29.2mm
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Conventional Length:
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200m
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Keyword:
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Hot Melt Adhesive Tape
|
|
Color:
|
Light Yellow
|
|
Proportion:
|
1.08±0.02g/cm³
|
|
Melting Point:
|
70-95℃ (Tunsing DSC 214)
|
|
Melt Flow Index:
|
75±25g/10min（ASTM D1238-04）
|
|
Conventional Thickness:
|
0.055mm±0.008mm
|
|
Conventional Width:
|
29.2mm
|
|
Conventional Length:
|
200m
|
|
Keyword:
|
Hot Melt Adhesive Tape
|
29Mm Width Co-Polyamide Double Side Hot Melt Adhesive Tape for SIM Card
Hot Melt Adhesive Tape Product: DS-4
Hot Melt Adhesive Tape Description:
Hot Melt Adhesive Tape is used in the encapsulation of contact smart card. Excellent adhesion to PVC, FR-4 and other materials.
The hot melt adhesive tape belongs to medium and low temperature . The strong cohesive force and good flexibility ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.
Hot Melt Adhesive Tape Applications:
DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and contact bank card.
Hot Melt Adhesive Tape Composition:
Polyamide synthesis modification
Hot Melt Adhesive Tape Physical Characteristics:
Hot Melt Adhesive Tape Recommended Bonding Conditions:
| Mechanical Mold Temperature | 140℃-160℃ | Mechanical Mold Temperature | 160℃-180℃ |
| Adhesive Time | 0.6S-1.2S | Packing Time | 0.6S-1.2S |
| Pressure | 0.25-0.4mpa | Pressure | 0.25-0.4mpa |
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