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Home > products > Hot Melt Adhesive Tape > Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card

Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card

Product Details

Place of Origin: Shenzhen,China

Brand Name: Tunsing

Certification: ROHS, REACH, Oeko-Tex

Model Number: DS-4

Payment & Shipping Terms

Minimum Order Quantity: 20 rolls

Price: USD20-28/roll

Packaging Details: 20roll/ctn,Carton size: 40cm*40cm*16.5cm.

Delivery Time: 1-3work days after received the payment

Payment Terms: L/C, T/T, PayPal, Alibaba Trade Assurance

Supply Ability: 50000 rolls per month

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Co Polyamide double sided adhesive tape

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Co Polyamide Hot Melt Adhesive Tape

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29Mm Hot Melt Adhesive Tape

Color:
Light Yellow
Proportion:
1.08±0.02g/cm³
Melting Point:
70-95℃ (Tunsing DSC 214)
Melt Flow Index:
75±25g/10min(ASTM D1238-04)
Conventional Thickness:
0.055mm±0.008mm
Conventional Width:
29.2mm
Conventional Length:
200m
Keyword:
Hot Melt Adhesive Tape
Color:
Light Yellow
Proportion:
1.08±0.02g/cm³
Melting Point:
70-95℃ (Tunsing DSC 214)
Melt Flow Index:
75±25g/10min(ASTM D1238-04)
Conventional Thickness:
0.055mm±0.008mm
Conventional Width:
29.2mm
Conventional Length:
200m
Keyword:
Hot Melt Adhesive Tape
Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card

29Mm Width Co-Polyamide Double Side Hot Melt Adhesive Tape for SIM Card

 

Hot Melt Adhesive Tape Product: DS-4

 

Hot Melt Adhesive Tape Description:

Hot Melt Adhesive Tape is used in the encapsulation of contact smart card. Excellent adhesion to PVC, FR-4 and other materials.

The hot melt adhesive tape belongs to medium and low temperature . The strong cohesive force and good flexibility ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.

 

Hot Melt Adhesive Tape Applications:

DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and contact bank card.

 

Hot Melt Adhesive Tape Composition:

Polyamide synthesis modification

 

Hot Melt Adhesive Tape Physical Characteristics:

 

Hot Melt Adhesive Tape Recommended Bonding Conditions:

Mechanical Mold Temperature 140℃-160℃ Mechanical Mold Temperature 160℃-180℃
Adhesive Time 0.6S-1.2S Packing Time 0.6S-1.2S
Pressure 0.25-0.4mpa Pressure 0.25-0.4mpa

Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card

 

 

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Co Polyamide Double Side Hot Melt Adhesive Tape 29Mm Width For SIM Card

 

 

 

 

 

 

 

Overall Rating

5.0
Based on 50 reviews for this supplier

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All Reviews

R
r*a
Bulgaria May 6.2025
STRONG ADHESION, I LIKE IT