Product Details
Place of Origin: Guangdong,China
Brand Name: Tunisng
Certification: REACH,US Califarnia Proposition 65,OEKO-TEX
Model Number: DS001TS
Payment & Shipping Terms
Minimum Order Quantity: 200yards (100yards/roll)
Price: negotiable
Packaging Details: 100y/roll, 2rolls/ctn
Delivery Time: 3-5 working days after received the payment
Payment Terms: Credit Card,Assurance trade order, T/T, PayPal and etc.
Supply Ability: 450000rolls per month
Keyword: |
Adhesive Film For Embroidery Patch |
Melting Point(°C): |
90-120℃ (Tunsing DSC 214) |
Sample: |
Free Sample |
Mechanical Mold Temperature: |
130℃-170℃ |
Brand: |
Tunsing |
Washing Resistant: |
40℃ |
Keyword: |
Adhesive Film For Embroidery Patch |
Melting Point(°C): |
90-120℃ (Tunsing DSC 214) |
Sample: |
Free Sample |
Mechanical Mold Temperature: |
130℃-170℃ |
Brand: |
Tunsing |
Washing Resistant: |
40℃ |
Free Sample Copolyester PES Hot Melt Adhesive Film for Embroidery Patch
Adhesive Film for Embroidery Patch Model: DS001TS
Adhesive Film for Embroidery Patch description
This product is a thermoplastic film hot melt adhesive, entrusted to the release of paper, can be repeatedly heated plasticized bonding.This kind of hot melt adhesive has excellent adhesion to textile products, PVC, PC.This product is resistant to dry cleaning and 40℃ washing.
Adhesive Film for Embroidery Patch Usage:
DS001TS is use for clothing, footwear, accessories, reflective materials, handbags, bags, embroidery, crafts bonding.
Adhesive Film for Embroidery Patch Recommended Bonding Conditions:
|
First Lamination |
Second Implanting | ||
| Mechanical Mold Temperature | 130℃-160℃ | Mechanical Mold Temperature | 130℃-170℃ |
| Hot Pressing Time | 5-15 seconds | Hot Pressing Time | 8-25 seconds |
| Pressure | 0.3-0.6mpa | Pressure | 0.3-0.6mpa |
1.Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.
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